BV11212-S Series WLP+ASIC 256×192 VOx Uncooled Thermal Module
Main Features:
- Compact Size: 20×20×10.4mm
- NETD<40mk
- Lightweight: <8g
- Low Power Consumption
- Rapid Development & Integration
Description:
The BV11212-S thermal imaging camera core is part of the BV series developed by Global Sensor Technology (GST). It incorporates a 256×192/12μm wafer level package (WLP) uncooled VOx infrared detector, high-performance signal processing circuitry, and advanced image processing algorithms. It offers an optional thermographic function with a measurement range from -20℃ to 150 ℃, suitable for industrial or body temperature measurement.
Thanks to its rugged and compact design, along with various industry-standard interfaces, this small infrared camera module finds wide applications in infrared thermal imaging fields such as Thermography, Smart Hardware, Drones, Advanced Driver Assistance Systems, etc. Its lightweight and flexible features, combined with various industry-standard interfaces, make this small infrared camera module advantageous for OEM customers for secondary development and integration into various thermal imagers and infrared thermographic cameras.
To date, we have provided our customers with various mature and stable infrared thermal module integration solutions. The BV series infrared thermal camera modules can be seamlessly integrated into a wide range of end products, resulting in significant cost savings for customers.