BV412 Series 120×90 VOx Uncooled Thermal Module
Key Features:
Affordable Price & Rapid Integration 
• Compact WLP infrared module; dimensions 8.5mm×8.5mm×9.16mm
• DVP Interface, adaptable to diverse embedded platforms
• Direct integration capability with visible camera module equivalent
• Provision of software development kit
 
Extended Operational Duration
• Ultra-low power consumption, as minimal as 10mW 
Description:BV412, part of the BV series miniature infrared modules crafted by Global Sensor Technology (GST), amalgamates optical lens, 120x90/17μm wafer level package (WLP) detector, and fundamental image processing circuitry for swift acquisition of thermal images and heat distribution analysis. BV412 thermal imaging core is engineered for small-scale, lightweight, and cost-effective (SWaP) infrared imaging endeavors. Its diminutive form factor and exceptionally low power consumption facilitate seamless integration into an array of smart devices, thermal imagers, or mobile terminals with stringent requirements on cost, size, and weight. Presently, BV412 series thermal cores and modules find extensive utility in the consumer electronics domain. BV412 thermal camera core module simplifies integration into a wider range of end products, substantially reducing customer costs.