New Generation BV1617G1 384×288 VOx Uncooled Thermal Module
Key Features:
Outstanding Performance
• Advanced image processing algorithm: NUC/3DNR/DNS/DRC/EE 
• Temperature range of -15℃～150℃, 0~550℃ (supports customization & expansion) 
 
Higher Efficiency
• Fast start-up time of 3s and minimal power consumption as low as 0.71W
 
Faster Integration 
Description:
The BV1617G1 uncooled infrared module represents the latest iteration of the BV1617G1 series developed by Global Sensor Technology (GST). It incorporates a 384x288/17μm wafer level package (WLP) infrared imaging detector, high-performance signal processing circuitry, and advanced image processing algorithms.
The BV1617G1 infrared module delivers sharp and clear thermal image quality, combined with a compact form factor and cost-effectiveness. It offers an optional thermographic function with a measurement range from -20℃ to 550 ℃, ideal for industrial temperature measurement applications.
 
To date, we have provided our customers with a range of mature and stable infrared thermal imaging solutions. The BV1617G1 series thermal imaging common module facilitates easier integration into various end products, resulting in significant cost savings for customers.
• Supports USB2.0/DVP/LVDS image output interfaces, RAW/YUV image data output, and serial port control.